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| Manufacturer: Chipbond Technology Corporation | URL: | Description: electronic & electrical components- wafer bumping, tape carrier packaging ( TCP), flip chip, wafer level CSP, gold bumps, solder bumps, chip on films.
Introduction: The company's products including wafer bumping, tape carrier packaging (TCP), flip chip, wafer level CSP, gold bump, solder bump, chip on film. | Categories: Electrical Tapes Wafer Bumping Electronic Packaging Carrier Tapes Packaging Tapes Packaging Films | Country: Taiwan | ::: Contact :::
Contact Person: Mr. Fei Jian Wu Telephone: Fax: Address:
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