Manufacturer: Orient Semiconductor Electronics Ltd. URL: Description:IC packaging design, IC packaging and testing services as well as
contract electronics manufacturing( CEM) services, PCB layout,
design-for-manufacturability, design-for-testability, quick turnaround
prototype assembly, material management( flexible, turnkey and consignment),
volume board assembly, multi-nation sites, backplane assembly. Categories: PCB Prototypes IC Packaging And Test Electronic Packaging Country: ::: Contact :::
Contact Person: Sales Department Telephone: Fax: Address:
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Tong Hsing is the professiional manufacturer in microelectronic module packaging - MEMS assembly, MEMS packaging, ceramic circuit substrate, hybrid substrate, ceramic thick film substrate, thick film substrate, available substrate technology, substrate manufacturing services, thick film substrate manufacturing, outsourced substrate technology, LTCC ( low temperature co fire ceramic), laminate, thin film on copper lead frame technology, assembly packaging services, SMT, COB, C4 & GGI flip chip ( controlled c design and manufacture of motherboards( mainboard), PC notebooks, laptop, and PC systems,
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