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Chipbond Technology Corporation

Manufacturer: Chipbond Technology Corporation
URL:
Description: electronic & electrical components- wafer bumping, tape carrier packaging ( TCP), flip chip, wafer level CSP, gold bumps, solder bumps, chip on films. Introduction: The company's products including wafer bumping, tape carrier packaging (TCP), flip chip, wafer level CSP, gold bump, solder bump, chip on film.
Categories: Electrical Tapes Wafer Bumping Electronic Packaging Carrier Tapes Packaging Tapes Packaging Films
Country: Taiwan
::: Contact ::: Contact Person: Mr. Fei Jian Wu Telephone: Fax: Address:
::: Page View ::: Today: 698; This Month: 698 This Year: 698; Total: 698
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