Manufacturer: Lingsen Precision Industries, Ltd. URL: Description:electronic & electrical components- semiconductor sub contract assembly, IC wafer, packaging and testing firms. Introduction: The company's products including semiconductor sub- contract assembly, IC wafer, packaging and testing firms. Received by ISO / TS16949 certification in 2005. Categories: Taiwan Semiconductor Manufacturing IC Packaging And Test Electronic Packaging IC Packaging Country: Taiwan ::: Contact :::
Contact Person: Mr. Shu Chiuan Ya Telephone: Fax: Address:
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Related Manufacturers electronic components & parts- LCD Driver IC Module, IC Card Package, IC packages of IST, smart card module assembly ( assemblies) & testing equipments, general IC assembly & testing, TCP packages, smart card molding ( mold, moulding, mouldes), semiconductor manufacturing. optoelectronic semiconductor- GaAs solar cell, GaAs solar cells, solar chip, solar chips, high efficiency GaAs solar EPI wafer, cell, module, GaAs laser diode, GaAs VCSEL, RCLED, EELD, sot package and testing PV modules, PV modules, solar, solar wafers, solar cells, laser optics, compound solar cells, laser mouses, mono crystalline, silicon, silicon wafers, high power RCLED, optical component, VCSEL ( Vertical Cavity Surface Emitting Laser) , RCLED, resonant cavity LED, high efficiency LED, solar lighting, switching power source, industrial switching power supplies for
computer, PC board, communication, medical, e-chemical, semiconductor
processing, auto-control, printing, high-frequency machine, laser,
lighting, DC-welding, plasma cutting/ welding/ coating machine,
ectrolyser, e-arc machine, electrostatic machine, magnetizing machine,
charger, oxyhydrogen machine, arcade( game machine), laboratory, etc. (1) molybdenum slugs/ discs for semiconductors- applied parts for
diodes, rectifiers, hybrids, power transistors, thyristors.
(2) lead frames- lead frames & connectors for TO-3P, TO-220, D2PAK,
ITO-220, GBU, GBL, DIP, MINI-BRIDGE, SMA, SMB, SMC.
(3) MIM( Metal Injection Mold) products- parts for business machines,
computer peripherals, locks, hand tools, automobile components,
aerospace industry, medical instruments, watch cases and bands,
shotguns, sewing mach electronics ( electrical, electric) components, electronic component & pars- passive & activity components- MLCC, multilayer chip type ceramic capacitors, LED lamp, LED lamps, LED dot matrix display, high power LED lamps, surface mount & leaded, resistors ( resisters), array, chips capacitors, inductors & beads, multilayer ferrite inductor, choke coil inductor, ferrite chip beads, ferrites tantalum capacitors, aluminium ( aluminum) electrolytic capacitors, relays, transistors, crystals, switches, battery ( 3G reperter, semiconductor laser diodes, LED, detectors, transmitter and receiver modules, transceivers. Professional manufacturer of pipe benders, tube benders and bicycle equipment. Our products include NCB/B type tube bender, CNC/NCR type tube bender, conventional control tube bender, NC pipe bender, general pipe bender, small angle pipe bender, rolling pipe bender, NCR & CNC pipe bender, bicycle tubing preparation equipment, bicycle quality control equipment, complete bicycle assembling equipment, etc.www.pipe-bender-1.com
Tong Hsing is the professiional manufacturer in microelectronic module packaging - MEMS assembly, MEMS packaging, ceramic circuit substrate, hybrid substrate, ceramic thick film substrate, thick film substrate, available substrate technology, substrate manufacturing services, thick film substrate manufacturing, outsourced substrate technology, LTCC ( low temperature co fire ceramic), laminate, thin film on copper lead frame technology, assembly packaging services, SMT, COB, C4 & GGI flip chip ( controlled c design and manufacture of motherboards( mainboard), PC notebooks, laptop, and PC systems,
add-on cards, computer monitors, multimedia peripherals, and scanners, and also
operates a state-of-the-art IC testing and packaging. integrated circuits ( IC design, OEM ODM), SMT, semiconductor manufacturing
, embedded memory and design, wafer fabrication. testing- memory tester,
logic tester, mixed tester, assembly- PLCC, DIP, SKINNY, SOP, SOJ, TSOP, QFP, TQFP, BGA
wafer grinding- 6" wafer-down to 10 mil, 8" wafer-down to 10 mil
, wafer probing (for memory, Logic and mixed ICs)
packaging (QFP, SOP, BGA), and final testing.