Manufacture of electrical and electronic components include (1) memory SiP: NAND flash + DDR2 SDRAM, DDR2 stack, NOR flash + pSRAM, NAND flash + M-SDRAM / M- DDR SDRAM, NOR flash / NAND flash + SDRAM, memory MCP, DSC/DV MCP, mobile phone MCP, smart phone MCP, module MCP, portable media players MCP, personal information devices MCP, handheld PCs MCP, multimedia phones/ DVB MCP. (2) SiP ODM: logic SiP, RF SiP, customized design, and so on.
Company Profile:ChipSiP Technology Co., Ltd, founded in 2002 and headquartered in Taipei, Taiwan, is an IC integration house which specializes in providing Memory SiP, Logic SiP, RF SiP and SiP-ODM miniaturization solutions. We offer slimmer and more valuable SiP solution.
ChipSiP concentrates on designing and integrating custom-designed oriented IC products and services. With our pioneering technologies, we achieve a major reduction in thickness and weight for a large multi-die package. The right SiP solution can help designers create thinner, smarter, more compact products. ChipSiP is now publicly traded in the Taiwan Emerging Stock Market under the 3637 stock quote and has received ISO9001 and ISO14001 Certification.
We are not only the first to market with a major SiP miniaturization solution in Taiwan, but also a global leading brand in defining Memory SiP specification for digital cameras. As well, we are also the world' first-to-market with combo NAND Flash, DDR/DDR2, and DDR2 SDRAM x 32-bit by 4-stacked chip.