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There are 8 manufacturers in this IC Packaging And Test category, the follows are 1 - 8 [Page 1]:
Browse manufacturers, suppliers, exporters by Category
Shuz Tung Machinery Industrial Co., Ltd.
Professional manufacturer of pipe benders, tube benders and bicycle equipment. Our products include NCB/B type tube bender, CNC/NCR type tube bender, conventional control tube bender, NC pipe bender, general pipe bender, small angle pipe bender, rolling pipe bender, NCR & CNC pipe bender, bicycle tubing preparation equipment, bicycle quality control equipment, complete bicycle assembling equipment, etc.
www.pipe-bender-1.com
Tong Hsing Electronic Ind., Ltd.
Tong Hsing is the professiional manufacturer in microelectronic module packaging - MEMS assembly, MEMS packaging, ceramic circuit substrate, hybrid substrate, ceramic thick film substrate, thick film substrate, available substrate technology, substrate manufacturing services, thick film substrate manufacturing, outsourced substrate technology, LTCC ( low temperature co fire ceramic), laminate, thin film on copper lead frame technology, assembly packaging services, SMT, COB, C4 & GGI flip chip ( controlled c
First International Computer Inc.
design and manufacture of motherboards( mainboard), PC notebooks, laptop, and PC systems,
add-on cards, computer monitors, multimedia peripherals, and scanners, and also
operates a state-of-the-art IC testing and packaging.
United Microelectronics Corp.( UMC Group)
integrated circuits ( IC design, OEM ODM), SMT, semiconductor manufacturing
, embedded memory and design, wafer fabrication. testing- memory tester,
logic tester, mixed tester, assembly- PLCC, DIP, SKINNY, SOP, SOJ, TSOP, QFP, TQFP, BGA
wafer grinding- 6" wafer-down to 10 mil, 8" wafer-down to 10 mil
, wafer probing (for memory, Logic and mixed ICs)
packaging (QFP, SOP, BGA), and final testing.
Greatek Electronics Inc.
testing and packaging of IC- integrated circuits.
Worldwide Semiconductor Manufacturing Co. ( WSMC)
electronic IC( integrated circuits) including logics, mixed modes, SRAMs, flashes, embedded
flash and DRAM to embedded DRAM, mask making, foundry services, probe card assembly, wafers/
chips probing, packaging and final test.
Lingsen Precision Industries, Ltd.
electronic & electrical components- semiconductor sub contract assembly, IC wafer, packaging and testing firms.
Orient Semiconductor Electronics Ltd.
IC packaging design, IC packaging and testing services as well as
contract electronics manufacturing( CEM) services, PCB layout,
design-for-manufacturability, design-for-testability, quick turnaround
prototype assembly, material management( flexible, turnkey and consignment),
volume board assembly, multi-nation sites, backplane assembly.
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